In-Situ Chronoamperometry for CMP Slurry Investigations

摘要

A new application of the electrochemical method, in situ chronoamperometry, has been developed and used as a tool for CMP slurry characterization. The measured current response, i, resulting from a small applied potential is fit to an exponential equation, i = i_o + A_1exp(-t/t_D). The fitting parameters serve as a measure of surface reactivity (i_o), surface film robustness (A_1), and the kinetics of film formation (t_D). A description of the method and correlations to polishing performance are discussed in this paper.