Pattern Symmetry and CMP Process Simulation

摘要

This paper reviews the effect of pattern symmetry on Chemical Mechanical Planarization (CMP) and proposes a methodology to reduce the computational time of the CMP process simulation based on the boundary element method (BEM). We focus on a unit field which generates the symmetry structures and we formulate the BEM field matrix by parallel translations and spin/flip operations. We also discuss the characteristics of the field matrix and demonstrate the applications of the methodology.