首页> 外文会议>Symposium Proceedings vol.849; Symposium on Kinetics-Driven Nanopatterning on Surfaces; 20041129-1202; Boston,MA(US) >Topography Evolution of Si (001) Substrate Fabricated by Ar~+ Ion Beam Sputter Etching
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Topography Evolution of Si (001) Substrate Fabricated by Ar~+ Ion Beam Sputter Etching

机译:Ar〜+离子束溅射刻蚀制备Si(001)衬底的形貌演化

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Self-formed nanopatterns on Si (001) substrates fabricated by ion beam sputter etching were investigated by atomic force microscopy (AFM). The ion beam sputtering was performed with an Ar~+ ion beam produced from a Kaufman type ion gun. In order to fabricate the periodic nanoscale patterns on Si surface, the effects of sputter parameters such as ion energy, flux, incident angle and etching time on surface morphology was investigated. As a result, nanometer scale ripples and 3-dimensioal nanodots were formed uniformly after ion beam sputtering. The surface morphology of Si was significantly dependent on incident angle and ion beam flux.
机译:通过原子力显微镜(AFM)研究了通过离子束溅射刻蚀在Si(001)衬底上形成的自形成纳米图案。离子束溅射是用由考夫曼型离子枪产生的Ar +离子束进行的。为了在硅表面上制备周期性的纳米级图形,研究了诸如离子能量,通量,入射角和蚀刻时间等溅射参数对表面形貌的影响。结果,在离子束溅射之后均匀地形成纳米级波纹和3-维纳米点。 Si的表面形态显着取决于入射角和离子束通量。

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