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Compliant substrate processes

机译:合规的基板工艺

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摘要

Recent results indicate that compliant substrates offer significant promise as a new approach for strain management in semiconductors. The potential applications include 1) the growth of device-quality highly mismatched materials on dissimilar substrates, and 2) the lateral control of material properties resulting from the effects of strain on bandstructure and/or growth dynamics. A significant amount of research in this area is dedicated to the reduction of extrinsic processing effects resulting from compliant substrate fabrication, and the development of simple models for understanding the observed reduction in defect density and/or strain in the epitaxial films grown on compliant substrates. A recent focus in our work has been on the growth of GaN on a novel and easily removable substrate -lighium gallate- for the regrowth on a bonded GaN template. The first step in this approach is the optimization of the growth of GaN on lithium gallate. In addition, this approach requires the use of an appropriate bonding layer to reduce the strain or defect production during growth due to coefficient of thermal expansion mismatches between the GaN sample and the handle wafer. Our work in this area will be highlighted in the context of an overview of various compliant substrate approaches and current results that indicate their efficacy.
机译:最近的结果表明,顺应性基板作为半导体应变管理的新方法具有广阔的前景。潜在的应用包括:1)器件质量高度不匹配的材料在不同衬底上的生长; 2)应变对能带结构和/或生长动力学的影响所导致的材料性能的横向控制。在该领域的大量研究致力于减少由顺应性衬底制造引起的外在处理效果,以及开发简单模型以理解在顺应性衬底上生长的外延膜中观察到的缺陷密度和/或应变的减小。我们工作的最新重点是在新型且易于移除的基板-没食子酸镓上生长GaN,以在键合的GaN模板上再生。该方法的第一步是优化镓酸锂上GaN的生长。另外,该方法需要使用适当的粘结层,以减少由于GaN样品与操作晶圆之间的热膨胀系数不匹配而导致的生长过程中的应变或缺陷产生。我们将在各种顺应性基材方法的概述以及表明其功效的当前结果的背景下重点介绍我们在这一领域的工作。

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