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Josephson junction fabricated by decanano technology using a focused ion beam

机译:通过聚焦离子束通过decanano技术制造的约瑟夫森结

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Abstract: High-Tc Josephson junctions have been fabricated by a focused Ga-ion beam (FIB) with a full width of half maximum of 10 nm. Using two functions of etching and deposition, two types of the junction structures have been made on MgO and SrTiO$-3$/ substrates. The first one is a grain boundary junction formed on the narrow modified area which is ion-irradiated on the substrate prior to film deposition. For this fabrication process, RSJ-type I-V characteristics are observed only on the MgO substrate. The Ic spread of working 30 junctions, $sigma@, is plus or minus 59% on the substrate of 1 cm$+2$/. The second one is a proximity-effect junction with Au barrier layer. The tunneling area has been formed by etching and deposition technique of high-resolution FIB after film deposition. This junction also shows RSJ-type properties. The first type junctions are applied for some integrated circuits, using advantage of freedom of choice in the position of each junction with the high accuracy of the ion-beam control. !16
机译:摘要:高Tc约瑟夫森结是由聚焦Ga离子束(FIB)制成的,其半峰全宽为10 nm。利用蚀刻和沉积的两种功能,在MgO和SrTiO $ -3 $ /衬底上制作了两种类型的结结构。第一个是在狭窄的改质区域上形成的晶界结,在薄膜沉积之前将其离子辐照在基板上。对于该制造过程,仅在MgO衬底上观察到RSJ型I-V特性。在1 cm $ + 2 $ /的基底上,工作的30个结点的ic传播$ sigma @为正负59%。第二个是与金阻挡层的邻近效应结。在膜沉积之后,通过高分辨率FIB的蚀刻和沉积技术形成了隧道区。此接合点还显示RSJ类型的属性。第一种结适用于某些集成电路,它利用每个结的位置自由选择的优势,并具有离子束控制的高精度。 !16

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