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HIGH PULL SPEED FOR FAST PULLED CRYSTAL IN CZ GROWTH

机译:CZ增长中的高速脉冲快速晶体

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摘要

Recently, the demands for COP (Crystal Originated Particle) free wafer are continuously increased to satisfy the quality of the high density IC manufacturing. Fast pulled crystal is one of solutions. Due to the high pull rate of fasted pulled crystal, the crystal passed fast through the 1100℃-1070℃ COP forming range so only COPs of smaller sizes and high density can be formed. Furthermore, such small size voids near the wafer surface can be easily removed by post-growth wafer annealing. In this work, we could estimated that the range of V/G for the fast pull crystal growth was between 0.138 and 0.315. And we conformed it is approached 0.2 by experiments.
机译:近来,对无COP(晶体起源的颗粒)晶片的需求不断增加,以满足高密度IC制造的质量。快速拉晶是解决方案之一。由于空载拉晶的高拉速,晶体快速通过了1100℃-1070℃的COP形成范围,因此只能形成较小尺寸和高密度的COP。此外,通过生长后晶片退火可以容易地去除晶片表面附近的这种小尺寸空隙。在这项工作中,我们可以估计快速拉晶生长的V / G范围在0.138和0.315之间。并且我们证明实验证明它接近0.2。

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