首页> 外文会议>Sixth International Symposium on Diamond Materials, 6th, Oct 17-22, 1999, Honolulu, Hawaii >SURFACE HYSTERESIS FOR COPPER TRAPPING ON BORON-DOPED DIAMOND ELECTRODE
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SURFACE HYSTERESIS FOR COPPER TRAPPING ON BORON-DOPED DIAMOND ELECTRODE

机译:掺硼金刚石电极上的铜滞留表面迟滞

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摘要

The electrochemical reduction of Cu~(2+) proceeded on both surfaces, which underwent electrochemical hydrogen or oxygen evolution. However, the reduced copper atoms were trapped only on the surface on which the hydrogen was evolved in advance. On the oxygen evolved surface, the reduced copper atoms were not trapped on the surface and it formed metal clusters in the solution. These two surfaces changed reversibly depending on the pretreatment. The time course of this surface transition was investigated as a function of the gas evolution period and also the electrode potential.
机译:Cu〜(2+)的电化学还原反应在两个表面上进行,并经历了氢或氧的电化学释放。然而,还原的铜原子仅被捕获在预先放出氢的表面上。在氧气析出的表面上,还原的铜原子没有被捕获在表面上,而是在溶液中形成了金属簇。取决于预处理,这两个表面可逆地变化。研究了该表面转变的时间过程与气体析出时间以及电极电势的关系。

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