Friction Induced Chemical Interaction During CMP ― A New Removal Mechanism

摘要

We used a fundamental approach to investigate the chemical interactions between copper and urethane surface in water under friction. We discovered the transfer of elements: copper and oxides stay on urethane while carbon and nitrogen on the copper surfaces. Such transfer, often non-equilibrium, could dominate the removal mechanisms of copper surface during CMP. In this presentation, we compare the results obtained through Auger and XPS analysis on copper and urethane surfaces before and after polishing. We discuss a possible new CMP mechanism ― the effects of friction induced transfer layer.