A New 3D, Direct-Write, Sub-Micron Microfabrication Process that Achieves TrueOptical, Mechatronic and Packaging Integration on Glass-Ceramic Substrates

摘要

The 2D MEMS processes today provide limited capability to achieve true 3D functionality. In addition,integration of the MEMS into functioning systems is difficult and often represents over 80% of the cost of the finalpackaged solution. Finally, the batch nature of the process, while efficient from a production efficiencystandpoint, introduces significant time and tooling investment to get functioning product. In this paper wedescribe a true sub-micron, 3D micro-fabrication process that represents a paradigm shift toward “rapidproduction” of integrated solutions for a broad range of applications including micro-replication, microrobotics,MOEMS and microfluidics.