首页> 外国专利> 3D MOLD FOR MANUFACTURE OF SUB-MICRON 3D STRUCTURES USING 2-D PHOTON LITHOGRAPHY AND NANOIMPRINTING AND 3D STRUCTURE MANUFACTURING PROCESS USING 3D MOLD

3D MOLD FOR MANUFACTURE OF SUB-MICRON 3D STRUCTURES USING 2-D PHOTON LITHOGRAPHY AND NANOIMPRINTING AND 3D STRUCTURE MANUFACTURING PROCESS USING 3D MOLD

机译:使用2D光子照相术和纳米浸渍技术制造亚微米3D结构的3D模具以及使用3D模具的3D结构制造过程

摘要

A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
机译:公开了一种制造3D模具以制造高通量和低成本的亚微米3D结构产品的方法。该方法结合了使用2-光子激光光刻和3D写入技术来制作3D结构产品每一层的3D模具,然后使用纳米压印从所述3D形成3D结构每一层的聚合物膜片该层的模具。然后将聚合物膜片的每一层制成亚微米3D结构产品。高通量和低成本亚微米3D结构产品每一层的3D模具还用于制作母模,然后将其用于形成3D结构每一层的聚合物膜片以制造子模具-微米3D结构产品。还公开了使用该过程的应用。

著录项

  • 公开/公告号KR101303500B1

    专利类型

  • 公开/公告日2013-09-09

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20107020686

  • 发明设计人 칸 쉬이-헤릉;

    申请日2009-11-23

  • 分类号G03F1/68;G03F7/24;G03F7/40;B29C33/38;

  • 国家 KR

  • 入库时间 2022-08-21 16:24:31

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