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Optimization of power AlGaN/GaN vertical HEMT devices with low on-state resistance and high breakdown voltage

机译:低导通电阻和高击穿电压的功率AlGaN / GaN垂直HEMT器件的优化

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Recently [1,2] we have developed a numerical technique for the optimization of parameters in semiconductor devices. This technique allows the computation (“redesign”) of the doping profiles of most semiconductor devices such as MOSFETs and SOI transistors, in order to decrease (or increase) the values of given parameters of the device. In this presentation we show how to adjust this optimization technique to the minimization of the on-state resistance (Ron) in AlGaN/GaN vertical HEMT devices with high breakdown voltage (BV). The technique is based on the computation of doping sensitivity functions of Ron and BV and the minimization of Ron, in which the optimization variables are the values of the doping concentrations at each location inside the device. Constraints are taken into consideration by using the method of Lagrange multipliers.
机译:最近[1,2],我们开发了一种数值技术来优化半导体器件中的参数。该技术允许计算(“重新设计”)大多数半导体器件(例如MOSFET和SOI晶体管)的掺杂分布,以减小(或增大)器件给定参数的值。在本演示中,我们展示了如何调整此优化技术,以使具有高击穿电压(BV)的AlGaN / GaN垂直HEMT器件的导通状态电阻(R on )最小。该技术基于R on 和BV的掺杂灵敏度函数的计算以及R on 的最小化,其中优化变量是在以下位置的掺杂浓度值设备内部的每个位置。通过使用拉格朗日乘数的方法来考虑约束。

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