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Surrounding gate MOSFETs S/D design for 28 nm technology

机译:面向28 nm技术的环绕栅MOSFET S / D设计

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A gate-last MOSFET has been suggested for 32 nm node CMOSFET, where the integration of a high-k gate dielectric and a metal gate electrode becomes essential to meet the transistor performance requirement. The gate-last MOSFET has been demonstrated as an effective integration scheme to avoid thermal instability and workfunction mismatch issues [1–2]. Even though feasibility of such gate structure for the 32 nm node MOSFET have been recently demonstrated, a comprehensive study on the performance impact of the gate structures has yet to be reported. In this work, we investigate the effect of the gate structures on the transistor performance and optimize the source/drain overlap to the gate for a 16 nm MOSFET using TCAD simulation.
机译:对于32 nm节点CMOSFET,建议采用后栅极MOSFET,在该晶体管中,高k栅极电介质和金属栅电极的集成对于满足晶体管性能要求至关重要。后栅极MOSFET已被证明是一种有效的集成方案,可以避免热不稳定性和功函数失配问题[1-2]。尽管最近已经证明了这种栅极结构可用于32 nm节点MOSFET的可行性,但尚未有关于栅极结构性能影响的全面研究报告。在这项工作中,我们使用TCAD仿真研究了栅极结构对晶体管性能的影响,并优化了16 nm MOSFET的栅极的源极/漏极重叠。

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