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Surrounding gate MOSFETs S/D design for 28 nm technology

机译:围绕28 NM技术的栅极MOSFET S / D设计

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A gate-last MOSFET has been suggested for 32 nm node CMOSFET, where the integration of a high-k gate dielectric and a metal gate electrode becomes essential to meet the transistor performance requirement. The gate-last MOSFET has been demonstrated as an effective integration scheme to avoid thermal instability and workfunction mismatch issues [1–2]. Even though feasibility of such gate structure for the 32 nm node MOSFET have been recently demonstrated, a comprehensive study on the performance impact of the gate structures has yet to be reported. In this work, we investigate the effect of the gate structures on the transistor performance and optimize the source/drain overlap to the gate for a 16 nm MOSFET using TCAD simulation.
机译:已经提出了32nm节点CMOSFET的栅极 - 最后的MOSFET,其中高k栅极电介质和金属栅电极的积分变得必不可满足晶体管性能要求。栅极 - 最后的MOSFET被证明为有效的集成方案,以避免热不稳定和工作功能不匹配问题[1-2]。尽管最近已经证明了32nm节点MOSFET的这种栅极结构的可行性,但是尚未报告对栅极结构的性能影响的综合研究。在这项工作中,我们研究了使用TCAD仿真对16nm MOSFET的晶体管性能对晶体管性能的影响,并优化到栅极的源/漏极重叠。

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