Improved reliability of interconnects of electronics components

机译：改善电子元件互连的可靠性

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The work is devoted to the analysis of the shortcomings of existing connectors for connection of FFS and FPC cables. The design of a new type of connector is proposed and the minimum possible dimensions are calculated.

机译：这项工作致力于分析现有的用于FFS和FPC电缆连接的连接器的缺点。提出了一种新型连接器的设计，并计算了最小可能的尺寸。

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来源
《The Second International Conference on Information and Telecommunication Technologies and Radio Electronics》|2017年|1-5|共5页
会议地点 Odessa(UA)
作者
Nevliudov Igor; Razumov-Fryziuk Ievgenii; Palahin Victor;
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作者单位

Department of computer-integrated technologies, automation and mechatronics, Kharkiv National University of Radioelectronics, Nauky ave., 14, Kharkiv, Ukraine, 61166;

Department of computer-integrated technologies, automation and mechatronics, Kharkiv National University of Radioelectronics, Nauky ave., 14, Kharkiv, Ukraine, 61166;

Department of computer-integrated technologies, automation and mechatronics, Kharkiv National University of Radioelectronics, Nauky ave., 14, Kharkiv, Ukraine, 61166;

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会议组织
原文格式 PDF
正文语种 eng
中图分类
关键词
Contacts; Connectors; Conductors; Polyimides; Aluminum; Reliability; Mechanical cables;

机译：触点;连接器;导体;聚酰亚胺;铝;可靠性;机械电缆;;

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机译：近场EMC研究以提高电子组件的可靠性
2. Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices [J] . Nadeem Qaiser, Asrar Nabil Damdam, Sherjeel Munsif Khan, Journal of Applied Physics . 2021,第1期

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3. Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics [J] . Progress in Artificial Intelligence . 2020,第2期

机译：互连灵活性对柔性混合电子动态弯曲可靠性的影响
4. Improved reliability of interconnects of electronics components [C] . Nevliudov Igor, Razumov-Fryziuk Ievgenii, Palahin Victor International Conference on Information and Telecommunication Technologies and Radio Electronics . 2017

机译：改进了电子组件互连的可靠性
5. First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =電子封裝中的第一級互連：合金銀互聯金屬生長動力學和他們的機械可靠性對線束的影響 [D] . Tobias, Russell Howard. 2019

机译：First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连：合金银互联金属生长动力学和他们的机械可靠性对线束的影响
6. Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models [O] . Terence K.S. Wong 2012

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7. Parylene C for hermetic and flexible encapsulation of interconnects and electronic components [O] . Jarboui Ahmed, Cauwe Maarten, Vermeiren Filip, 2013

机译：parylene C用于密封和柔性封装互连和电子元件
8. Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C) [R] . Ramesham, Rajeshuni, Ghaffarian, Reza, Shapiro, Andrew, 2005

机译：极端低温（-190摄氏度和-120摄氏度）下高级倒装芯片互连电子封装组件的可靠性评估

Improved reliability of interconnects of electronics components

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