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Near-field EMC study to improve electronic component reliability

机译:近场EMC研究以提高电子组件的可靠性

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摘要

This paper deals with the study of near-field electromagnetic compatibility (EMC) characterisation of electronic devices in order to improve their reliability in the context of the embedded electronic systems where the proximity of RF blocks and digital parts on the same circuits or in the same package increases. Such juxtaposition can lead to more important electromagnetic interferences inducing functional failures and the knowledge of EM behaviour of electronics becomes necessary. After a brief theoretical approach description, the experimental study is detailed. Simulations and measurements are performed and evidence the frequency range of device susceptibility.
机译:本文旨在研究电子设备的近场电磁兼容性(EMC)表征,以便在嵌入式电子系统的环境中提高其可靠性,在嵌入式电子系统中,同一电路或同一电路中RF模块和数字部件的接近度包装增加。这种并置会导致更重要的电磁干扰,从而导致功能故障,因此有必要了解电子设备的EM行为。在简要介绍理论方法之后,将对实验研究进行详细介绍。进行仿真和测量,并证明设备敏感性的频率范围。

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