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Low-leakage SRAM design with dual V/sub t/ transistors

机译:具有双V / sub t /晶体管的低泄漏SRAM设计

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This paper presents a method based on dual threshold voltage assignment to reduce the leakage power dissipation of SRAMs while maintaining their performance. The proposed method is based on the observation that the read and write delays of a memory cell in an SRAM block depend on the physical distance of the cell from the sense amplifier and the decoder. The key idea is thus to realize and deploy different types of six-transistor SRAM cells corresponding to different threshold voltage assignments for individual transistors in the cell. Unlike other techniques for low-leakage SRAM design, the proposed technique incurs no area or delay overhead. In addition, it results only in a slight change in the SRAM design flow. Finally, it improves the static noise margin under process variations. Experimental results show that this technique can reduce the leakage-power dissipation of a 64Kb SRAM by more than 35%
机译:本文提出了一种基于双阈值电压分配的方法,可在保持其性能的同时减少SRAM的泄漏功耗。所提出的方法基于以下观察结果:SRAM块中存储单元的读写延迟取决于该单元与读出放大器和解码器之间的物理距离。因此,关键思想是实现和部署对应于单元中各个晶体管的不同阈值电压分配的不同类型的六晶体管SRAM单元。与其他用于低泄漏SRAM设计的技术不同,所提出的技术不会产生面积或延迟开销。此外,它仅会导致SRAM设计流程稍有变化。最后,它提高了工艺变化下的静态噪声容限。实验结果表明,该技术可以将64Kb SRAM的泄漏功耗降低35%以上

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