Towards quantification of contaminants in electrodeposited Cu films

摘要

By means of linear sweep voltammetry (LSV) we studied the tendency of various suppressor additives towards the formation of stable adducts with Cu(I)-MPS intermediates which form as byproducts of the SPS reaction cycle during an additive-assisted Cu electrodeposition. These LSVs demonstrate a gradual transition from a pure antagonistic SPS/suppressor interplay (superfill capabilities) to a pure synergistic SPS/suppressor interplay (leveling capabilities). SIMS depth profiling experiments on electroplated Cu films indicate that the MCs~+ detection mode is superior to the conventional negative SIMS detection mode for the analysis of the N content in those Cu films.