【24h】

ELECTRICAL PROPERTIES OF LOW-TEMPERATURE BONDED UNIPOLAR Si/Si JUNCTIONS

机译:低温键合单相Si / Si结的电学性质

获取原文
获取原文并翻译 | 示例

摘要

Low-temperature bonded Si/Si interfaces have been investigated by performing current and capacitance measurements as a function of applied voltage on two types of structures: Samples treated to become hydrophilic and samples treated in oxygen-plasma before bonding. The samples have been stored for more than five years. New interface state distributions have appeared together with mobile charges giving rise to hysteresis effects in electrical characteristics. The results indicate that mobile charges are trapped at the interfaces between an intermediate layer and the two silicon surfaces and with a metastable state at some distance from these interfaces. The concentration of interface states depends on the position of the mobile charges. A qualitative similarity exists between the samples with hydrophilic surface preparation before bonding and those treated in oxygen plasma.
机译:通过在两种类型的结构上进行电流和电容测量(作为施加电压的函数),研究了低温键合Si / Si界面:键合之前已处理成亲水性的样品和在氧等离子体中处理过的样品。样品已保存五年以上。新的界面状态分布与移动电荷一起出现,从而引起电特性的滞后效应。结果表明,移动电荷被捕获在中间层和两个硅表面之间的界面处,并且在与这些界面相距一定距离处处于亚稳态。接口状态的集中度取决于移动电荷的位置。在键合之前进行亲水表面处理的样品与在氧等离子体中处理过的样品之间存在定性相似性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号