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SIMS DEPTH PROFILING OF B AND AS IMPLANTS IN SI_(1-x)GE_x AND STRAINED SI/SI_(1-x)GE_x

机译:SI_(1-x)GE_x和受约束的SI / SI_(1-x)GE_x中B和AS植入的SIMS深度分析

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摘要

B and As implants in strained Si or SiGe were studied using secondary ion mass spectrometry (SIMS). Sputter rate and ion yield variations in the different matrices (strained Si vs. SiGe) led to small errors in the dopant profiles. The accuracy of the depth profiles was improved by correcting the sputter rates and ion yields as a function of the Ge content throughout the depth profile. In addition efforts to improve the SIMS detection limit for As in SiGe was explored using various secondary ion species, with and without background subtraction.
机译:使用二次离子质谱(SIMS)研究了应变Si或SiGe中的B和As注入。溅射速率和离子产率在不同矩阵(应变Si与SiGe)中的变化导致掺杂剂分布中的小误差。通过校正溅射速率和离子产量作为整个深度剖面中Ge含量的函数,可以改善深度剖面的精度。另外,在有和没有背景扣除的情况下,人们探索了使用各种次级离子种类来提高SiGe中As的SIMS检测限的方法。

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