Buried Jumper Technology The Buried Jumper Technology (BJT) is a new method for producing Printed Circuit Boards with two, three or four layers in an economical way. It was developed with special emphasis of using well-known materials and equipment. With the combination of a special copper foil, paper based basematerial and a modified pressing process a significant cost reduction compared to Multilayer Boards is possible. Depending on the technical demand you can start with a single sided or with a double sided basematerial. After the printing process of the first layer a special copper foil with an adhesive on the rough side is pressed on the etched side of the basematerial. The pressing technique is modified and not directly comparable with multilayer production.
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