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Distictive thermoelectric properties of P doped SiGe

机译:P掺杂SiGe的独特热电性能

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In the earlier work on Silicon Germanium, we have obtained a very low thermal conductivity of 1 W/mK in amorphous SiGe alloy prepared by high energy ball milling. However, the figure of merit ZT was very low due to the high electrical resistivity. In this work, we tried to solve the problem of high electrical resistivity by tuning the carrier concentration. The samples were prepared by high energy ball milling in a controlled atmosphere of Argon and Hydrogen to avoid the oxidation. The bulk samples were prepared by spark plasma sintering at two different temperatures to study the effect of crystallinity on transport properties. The X-Ray diffraction and Scanning electron microscopy confirmed the formation of the semi-crystalline microstructure. In the transport properties, we observed a very large magnitude Seebeck coefficient of〜400 μV K, electrical resistivity was in few m-ohm-cm range at high temperature, together with a very low thermal conductivity of less than 2 W/mK. The unusual temperature dependence of electrical resistivity was might be due to Anderson localization. Hence, we obtained a very large magnitude of ZT =1.7 at 1000 K in heavily P doped Semi crystalline SiGe samples. The detailed analysis of microstructure and transport properties will be shown in the presentation.
机译:在较早的硅锗研究中,我们通过高能球磨制备的非晶SiGe合金的导热系数非常低,仅为1 W / mK。但是,由于高电阻率,品质因数ZT非常低。在这项工作中,我们试图通过调整载流子浓度来解决高电阻率的问题。为了避免氧化,在受控的氩气和氢气气氛中通过高能球磨制备了样品。通过在两个不同温度下进行火花等离子体烧结制备大块样品,以研究结晶度对传输性能的影响。 X射线衍射和扫描电子显微镜证实了半结晶微结构的形成。在传输性能方面,我们观察到很大的塞贝克系数,约为〜400μVK,高温下的电阻率在几m ohm-cm的范围内,而导热率却非常低,小于2 W / mK。电阻率异常的温度依赖性可能是由于安德森局部化。因此,我们在重掺杂P的半结晶SiGe样品中在1000 K下获得了非常大的ZT = 1.7。微观结构和传输特性的详细分析将在演示中显示。

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