Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

机译：Sn-3.0Ag-0.5Cu无铅焊料合金中各相机械性能的温度依赖性

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The commercial Sn-3.0Ag-0.5Cu (SAC) lead-free solder alloy consists of Sn-rich and eutectic phases. The mechanical properties of these individual phases were demonstrated to be a function of the temperature. The nano-indentation equipment assembled with a

机译：商业化的Sn-3.0Ag-0.5Cu（SAC）无铅焊料合金由富锡和共晶相组成。这些单个相的机械性能被证明是温度的函数。纳米压痕设备与

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来源
《Power Semiconductor Devices & IC's, 2005 IEEE International Symposium on》|2008年|P.466-471|共6页
会议地点 Lake Buena Vista,FL,USA
作者
Feng Gao; Nishikawa; H.; Takemoto; T.; Jianmin Qu;
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copper alloys; creep; elastic moduli; hardness; indentation; silver alloys; solders; tin alloys; SnAgCu; activity energy; creep; deformation; elastic modulus; eutectic phases; hardness; lead-free solder alloy; nano-indentation; strain rate sensitivity index;

机译：铜合金蠕变;弹性模量硬度;缩进;银合金焊锡;锡合金锡银铜;活动能量蠕变;形变;弹性模量共晶相;硬度;无铅焊料合金；纳米压痕应变率敏感性指数;
入库时间 2022-08-26 14:33:56

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1. Mechanical Properties Versus Temperature Relation Of Individual Phases In Sn-3.0ag-0.5cu Lead-free Solder Alloy [J] . Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Microelectronics reliability . 2009,第3期

机译：Sn-3.0ag-0.5cu无铅焊料合金的力学性能与各相的温度关系
2. Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation [J] . Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui Journal of Electronic Packaging . 2015,第3期

机译：具有纳米压痕的特殊堆积效应的Sn-Ag-Cu无铅焊料在不同温度下的单相力学性能
3. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures [J] . Ruyu Tian, Yanhong Tian, Chenxi Wang, Materials Science and Engineering . 2017,第JANa27期

机译：低温下Sn-3.0Ag-0.5Cu焊料合金和接头的力学性能和断裂机理
4. Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy [C] . Feng Gao, Nishikawa H., Takemoto T., Electronic Components and Technology Conference . 2008

机译：SN-3.0AG-0.5CU无铅焊料合金中个体阶段机械性能的温度依赖性
5. TEMPERATURE DEPENDENCE OF THE MECHANICAL PROPERTIES OF SOME ALUMINUM ALLOYS CONTAINING LOW MELTING POINT INCLUSIONS. [D] . ROTH, MARTIN CHARLES. 1978

机译：包含低熔点点的某些铝合金的机械性能的温度依赖性。
6. Effects of Hot Extrusion Temperature on Mechanical and Corrosion Properties of Mg-Y-Zn-Zr Biological Magnesium Alloy Containing W Phase and I Phase [O] . Xiaofeng Wu, Chunxiang Xu, Jun Kuan, 2020

机译：热挤压温度对含W相和I相的Mg-Y-Zn-Zr生物镁合金力学性能和腐蚀性能的影响
7. Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties [O] . Kohei MITSUI, Ikuo SHOHJI, Tatsuya KOBAYASHI, 2019

机译：将痕量Ni和Ge加入SN-Sb-Ag高温无铅焊料合金的影响其机械性能

Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

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