机译:低温下Sn-3.0Ag-0.5Cu焊料合金和接头的力学性能和断裂机理
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Shanghai Academy of Spaceflight Technology, Shanghai 201109, China;
Mechanical characterization; Fracture; Cryogenic temperatures; Strain rate; Lead-free solder;
机译:Sn-3.0ag-0.5cu无铅焊料合金的力学性能与各相的温度关系
机译:不同拉伸应变率和温度下SN-3.0AG-0.5CU(SAC305)焊丝微观结构演化的机械和微机械性能的关系及温度
机译:几何形状对微型球栅阵列结构Cu / Sn-3.0Ag-0.5Cu / Cu焊点力学性能和断裂行为的影响
机译:SN-37PB和SN-3.0AG-0.5CU BGA焊点在极端温度环境下的微观结构演化与力学性能
机译:低温温度和显微组织对铟锡焊点疲劳失效的影响
机译:用于微观结构和机械性能的数据集(CRCONI)97Al1.5Ti1.5中等熵合金在室内和低温温度下由自由端扭转扭曲的中等熵合金
机译:校正:机械合金纳米晶Fe-46的结构和磁性。%Co-34。%Ni-20。%合金粉末来自低温至升高的温度
机译:室温和低温下5 al-2.5 sN ELI钛的平面应变断裂韧性和力学性能最终报告