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Thin porous silicon films displaying a near-surface dip in porosity

机译:多孔硅薄膜显示出近表面孔隙率下降

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Studies of the depth profile of Porous Silicon (PS) structures etched under a wide span of different formation parameters have been performed using Spectroscopic Ellipsometry (SE) and Transmission Electron Microscopy (TEM). Incorporation of a sharp dip in the porosity profiles close to the sample surface was required for several types of PS films in order to successfully fit ellipsometric data to a Bruggeman Effective Medium Model (BEMA). TEM studies show a corresponding lower porosity region near the sample surface. Investigations have been performed in order to understand the origin of this dip and to explore the parameter space where it is detected. The detected low porosity region is discussed in the context of current knowledge on pore nucleation and growth mechanisms of PS.
机译:已经使用光谱椭偏仪(SE)和透射电子显微镜(TEM)对在宽范围的不同形成参数下蚀刻的多孔硅(PS)结构的深度轮廓进行了研究。为了成功地将椭偏数据与Bruggeman有效介质模型(BEMA)拟合,对于几种类型的PS膜,都需要在靠近样品表面的孔隙率剖面中加入陡峭的倾角。 TEM研究表明,样品表面附近有相应的较低孔隙率区域。为了了解该倾角的起因并探索检测到该倾角的参数空间,已经进行了调查。在有关PS的孔成核和生长机理的现有知识的背景下,讨论了检测到的低孔隙度区域。

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