Characterization of PCB Expansion using Moire lnterferometry and the lmpact of Expansion Variability on the Life of Solder Joints

摘要

Area-array packages such as the Ball-Grid-Array (BGA), Chip-Scale-Package (CSP), and the DIrect-Chip-Attach (DCA) are becoming increasingly common at the present time. The major industry roadmaps such as the SIA roadmap indicate a critical role for these packages in future applications with large I/O counts. For instance, the SIA roadmap predict that by the year 2012, complex, high-density area array packages with over 5000 I/Os will be needed.