Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage

摘要

With failure of solder joints (SJs) in photovoltaic (PV) modules constituting over 40% of the total module failures, investigation of SJ's reliability factors is critical. This study employs the Garofalo creep model in ANSYS Finite Element Modelling (FEM) to simulate solder joint damage. Accumulated creep strain energy density is used to quantify damage. PV modules consisting of interconnections formed from different material combinations (silver, copper, aluminum, zinc, tin and brass) are subjected to induced temperature cycles ranging from -40 °C to +85 °C. Results show that zinc-solder-silver joint having the highest CTE mismatch of 19.6 ppm exhibits the greatest damage while silver-solder-silver with no mismatch possesses the least damage.