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Thermal annealing induced enhancement in the performance of polymer field-effect-transistor using poly(3-hexylthiophene) and 6,6-phenyl C_(61)-butyric acid methyl ester

机译:热退火诱导聚合物(3-己基噻吩)和6,6-苯基C_(61)-丁酸甲酯的聚合物场效应晶体管的性能增强

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摘要

Polymer field-effect transistors with a field-effect mobility of μ≈0.3 cm~2/V·s have been demonstrated using regioregular poly(3-hexylthiophene) (rr-P3HT). Devices were fabricated by dip-coating the semiconducting polymer followed by annealing at 150℃ for 10 minutes. The heat annealed devices exhibit an increased field-effect mobility compared with the as-prepared devices. Morphology studies and analysis of the channel resistance demonstrate that the annealing process increases the crystallinity of rr-P3HT and improves the contact between the electrodes and the P3HT films, thereby increasing the field effect mobility of the films. Based on the results obtained from unipolar FETs using rr-P3HT, we have also applied postproduction heat treatment to ambipolar polymer FETs fabricated with rr-P3HT and C_(61)-butyric acid methyl ester (PCBM). Devices were fabricated using aluminum (Al) source and drain electrodes to achieve an equivalent injection for the both holes and electrons. As the case of P3HT unipolar FETs, the thermal annealing method also improves the film morphology, crystallinity, and the contact properties between Al and active layer, thereby resulting in excellent ambipolar characteristics with the hole mobility of 1.7x10~(-3) cm~2/V·s and the electron mobility of 2.0X10~(-3) cm~2/V·s.
机译:使用区域规则的聚(3-己基噻吩)(rr-P3HT)证明了场效应迁移率μ≈0.3cm〜2 / V·s的聚合物场效应晶体管。通过浸涂半导体聚合物,然后在150℃下退火10分钟来制造器件。与准备好的装置相比,热退火的装置表现出增加的场效应迁移率。沟道电阻的形态学研究和分析表明,退火过程提高了rr-P3HT的结晶度,并改善了电极与P3HT薄膜之间的接触,从而提高了薄膜的场效应迁移率。基于从使用rr-P3HT的单极FET获得的结果,我们还将生产后热处理应用于由rr-P3HT和C_(61)-丁酸甲酯(PCBM)制造的双极性聚合物FET。使用铝(Al)源电极和漏电极制造器件,以实现对空穴和电子的等效注入。与P3HT单极FET一样,热退火方法还改善了薄膜的形貌,结晶度以及Al与有源层之间的接触特性,从而产生了极好的双极性特性,空穴迁移率为1.7x10〜(-3)cm〜 2 / V·s,电子迁移率为2.0X10〜(-3)cm〜2 / V·s。

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