Abstract: The MICRASCAN-II (MS-II) is a 0.50 NA DUV broadband illumination (245 nm to 252 nm) step-and-scan exposure system manufactured by Silicon Valley Group Lithography Systems, Inc. (SVGL) of Wilton, Connecticut. The system is designed to provide 350 nm resolution and 90 nm overlay in a semiconductor manufacturing environment. Overlay system improvements and performance testing have been made on pre-production and production versions of the MS-II. The MICRASCAN system has both a laser illuminated `through-the-lens' (TTL) and a broadband illuminated `off-axis alignment system' (OAAS). This paper summarizes the progression of system overlay improvements and the results of the tests conducted. Results from initial baseline tests pre and post system improvements on artifact wafers are presented. Product level data collected from marathon testing showing system performance on six individual product levels and areas for improvement are presented. Descriptions of an improved TTL alignment system and its attributes are provided. A description of a new and completely independent alignment system (OAAS) and its attributes are discussed. !4
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机译：摘要：MICRASCAN-II（MS-II）是0.50 NA DUV宽带照明（245 nm至252 nm）步进扫描式曝光系统，由康涅狄格州威尔顿的硅谷集团光刻系统有限公司（SVGL）制造。该系统旨在在半导体制造环境中提供350 nm分辨率和90 nm覆盖。已对MS-II的预生产和生产版本进行了覆盖系统改进和性能测试。 MICRASCAN系统既有激光照明的“透镜直通”（TTL），也有宽带照明的“离轴对准系统”（OAAS）。本文总结了系统覆盖改进的进展以及所进行的测试的结果。给出了在人工晶片上进行系统改进之前和之后进行的初始基准测试的结果。展示了从马拉松测试中收集的产品级别数据，该数据显示了六个单独产品级别和需要改进的方面的系统性能。提供了改进的TTL对齐系统及其属性的描述。讨论了一种新的，完全独立的对齐系统（OAAS）及其属性的描述。 ！4
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