Processing Technology for High Density Multifunctional Integration (HDMI) using Wafer Bonding and Monolithic Inter-Wafer Interconnection

摘要

In this paper we describe an approach of high density multifunctional integration (HDMI) based upon three-dimensional (3D) integration scheme, which uses dielectric-glue bonding and copper damascene inter-wafer vertical interconnects. The HDMI technology alleviates processing constraints associated with system-on-a-chip (SoC) electronic integrations, while providing the capability of extension to opto-electronic, bio-molecular and other heterogeneous applications, including sensors and actuators. Major processing challenges for HDMI are presented, namely, wafer-scale alignment accuracy, bonding integity, wafer thinning and leveling control, and inter-wafer via formation. HDMI processing for heterogeneous integrations (e.g., optical HDMI and integrated MEMS) is discussed, and an HDMI-enabled package assembly is described.