RF-Microwave High Performance Passives for Wireless LAN Applications

摘要

This paper presents the design, measured data, andsystematic analysis of spiral embedded inductors (seriesand parallel) and capacitors fabricated on liquid crystalpolymer substrate using MCM-D technology. Severalconfigurations for inductors are investigated to optimizethe inductor layout dimensions such as conductor width,number of turns, inner diameter, spacing betweeninductor and ground. Moreover, the metal used isaluminium but even with this metal maximum Q of 64 fora 1.4 nH inductor at 5.25 GHz. The quality factor ofcapacitors as high as 1100. High-Q inductors andcapacitors embedded on liquid crystal polymer substratecan find numerous RF and microwave system-on-package(SoP) applications, such as IF/RF bandpass filters, LNAsetc. and we have demonstrated this by designing acomplete RF front-end for wireless applications, in whichIC chips are flip-chip mounted on the package.