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Effect of Substrate Bias on Structure and Properties of W incorporated Diamond-like Carbon Films

机译:衬底偏压对掺W类金刚石碳膜结构和性能的影响

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W incorporated diamond-like carbon (W-DLC) films were deposited on silicon (100) wafers by a hybrid deposition method combining ion beam deposition of carbon with DC magnetron sputtering of tungsten. During the films deposition, a wide range of negative bias voltage from 0 to -600 V was applied. W concentration in the film could be controlled by varying the Ar/C_6H_6 ratio in the supplying gas. In the present experimental condition, WC_(1-x) nano-sized particles were not observed in the amorphous carbon matrix. Regardless of the W concentration in the film, it was found that the G-peak position of the Raman spectra had a lowest value at a bias voltage of -200 V, which represents the highest sp~3 bond fraction in the film. The highest residual stress, hardness and Young's modulus were also observed when the bias voltage was -200 V. This result shows that the mechanical properties of W-DLC films were mainly dependent on the atomic bond structure of carbon. On the other hand, the electrical resistivity significantly decreased by the W incorporation.
机译:通过结合碳的离子束沉积和钨的直流磁控溅射的混合沉积方法,将掺入W的类金刚石碳(W-DLC)膜沉积在硅(100)晶片上。在膜沉积期间,施加了从0到-600 V的宽范围的负偏压。可以通过改变供给气体中的Ar / C_6H_6比率来控制膜中的W浓度。在当前的实验条件下,在无定形碳基质中未观察到WC_(1-x)纳米尺寸的颗粒。无论膜中的W浓度如何,都发现在-200 V的偏置电压下,拉曼光谱的G峰位置具有最低值,这表示膜中最高的sp〜3键分数。当偏压为-200 V时,还观察到最高的残余应力,硬度和杨氏模量。该结果表明,W-DLC膜的机械性能主要取决于碳的原子键结构。另一方面,通过掺入W,电阻率显着降低。

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