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Effects of Silicon Source Gas and Substrate Bias on the Film Properties of Si-Incorporated Diamond-Like Carbon by Radio-Frequency Plasma-Enhanced Chemical Vapor Deposition

机译:射频等离子体增强化学气相沉积法研究硅源气和衬底偏压对掺硅的类金刚石碳膜性能的影响

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摘要

We have deposited Si-incorporated diamond-like carbon (DLC) films by radio-frequency plasma-enhanced chemical vapor deposition using methane, argon, and organosilanes, and investigated the effects of Si source gas (monomethylsilane, dimethylsilane) and substrate bias (negative dc bias, negative pulse bias) on the structure and the mechanical and tribological properties of the films. The Si-DLC films deposited using monomethylsilane as a Si source gas tended to have a higher Si atomic fraction ratio [Si/(Si + C)] than the films deposited using dimethylsilane. Friction coefficient and internal stress decreased by the incorporation of Si into the films. However, many particles composed mainly of Si were observed on the film surfaces when deposition using a dc bias was carried out at higher monomethylsilane or dimethylsilane flow ratios. It was found that for both the Si source gases, the use of a pulse bias was effective in suppressing the formation of particles and further decreasing friction coefficient and internal stress. Additionally, the pulse-biased Si-DLC films were found to have a higher wear resistance than the dc-biased Si-DLC films.
机译:我们已经使用甲烷,氩气和有机硅烷通过射频等离子体增强化学气相沉积法沉积了掺硅的类金刚石碳(DLC)膜,并研究了硅源气体(单甲基硅烷,二甲基硅烷)和衬底偏压(负离子)的影响直流偏置,负脉冲偏置)对薄膜的结构以及机械和摩擦学性能的影响。与使用二甲基硅烷沉积的膜相比,使用单甲基硅烷作为Si源气体沉积的Si-DLC膜倾向于具有更高的Si原子分数比[Si /(Si + C)]。通过在薄膜中掺入Si可以降低摩擦系数和内部应力。然而,当在较高的单甲基硅烷或二甲基硅烷流量比下使用dc偏压进行沉积时,在膜表面上观察到许多主要由Si组成的颗粒。已发现对于两种Si源气体,使用脉冲偏压可有效地抑制颗粒的形成并进一步减小摩擦系数和内应力。另外,发现脉冲偏置的Si-DLC膜比直流偏置的Si-DLC膜具有更高的耐磨性。

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  • 来源
    《Japanese journal of applied physics》 |2009年第11期|116002.1-116002.8|共8页
  • 作者单位

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

    Research Institute of Electrical Communication, Tohoku University, Sendai 980-8577, Japan;

    Tohoku Institute of Technology, Sendai 982-8577, Japan;

    Nagaoka University of Technology, Nagaoka, Niigata 940-2188, Japan;

    Center of Interdisciplinary Research, Tohoku University, Sendai 980-8578, Japan;

    Center of Interdisciplinary Research, Tohoku University, Sendai 980-8578, Japan;

    Yamagata University, Yonezawa, Yamagata 992-8510, Japan;

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

    Graduate School of Science and Technology, Hirosaki University, Hirosaki, Aomori 036-8561, Japan;

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