首页> 外文会议>MIPRO, 2012 Proceedings of the 35th International Convention >On the application of boron and phosphorus heavily doped LPCVD polycrystalline silicon thin films as thermoelectric materials
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On the application of boron and phosphorus heavily doped LPCVD polycrystalline silicon thin films as thermoelectric materials

机译:硼磷重掺杂LPCVD多晶硅薄膜在热电材料中的应用

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Even in the metallic regime, heavily doped polycrystalline silicon has high thermopower, but since recently, due its high resistivity combined with high thermal conductivity, silicon was not considered as a possible thermoelectric material. However, various reasons have encouraged investigations on polycrystalline silicon in order to enhance its TE properties. We discuss these reasons and give a short overview of the most promising results and works done in the field. We also present our incipient work on the LPCVD obtained polysilicon thin films annealed in various ways. The main important result we obtained so far is the high thermopower of a Si:B sample: +200 µV/K at room temperature; much higher than predicted for the common metals and the same as of Bi2Te3, the only thermoelectric material commercially used nowadays.
机译:即使在金属状态下,重掺杂的多晶硅也具有很高的热功率,但是自最近以来,由于其高电阻率和高导热率,人们不认为硅是可能的热电材料。然而,出于各种原因鼓励了对多晶硅的研究以增强其TE性能。我们讨论了这些原因,并简要概述了该领域中最有希望的结果和所做的工作。我们还介绍了我们在以各种方式退火的LPCVD获得的多晶硅薄膜上的初步工作。到目前为止,我们获得的主要重要结果是Si:B样品的高热功率:室温下+200 µV / K;比普通金属的预测值高得多,并且与当今商业上唯一使用的热电材料Bi2Te3相同。

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