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Failure Mechanisms and comparative study of ruggedness in IGBTs Devices (IR, IXYS)

机译:IGBT器件(IR,IXYS)的失效机理和耐用性的比较研究

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This paper present a detailed study of performance of two the most commercially available IGBT for International Rectifier and IXYS e.g. IRGBC40 (S, F,U) and IXGH40N60A, when subjected to two such stressful conditions short circuit operation and unclamped inductive switching and it takes into account specific phenomena limiting its SOA (Safe Operation Area), avalanche, second breakdown as well as latch up. As both these tests conditions are potentially destructive, it is extremely cost efficient to model the device performance under these conditions. The need of a good physics based simulation to carry out a reliability study is pointed out in this paper. An explanation comparison of ruggedness of IRGBC40 (S,F,U) as well as of IXGH40N60A which leads to a fundamental understanding of physics of two devices.
机译:本文对国际整流器和IXYS两种最商用的IGBT的性能进行了详细研究。 IRGBC40(S,F,U)和IXGH40N60A在两种压力条件下会发生短路操作和未钳位的电感性开关,并且考虑到限制其SOA(安全工作区),雪崩,二次击穿以及闩锁的特定现象。由于这两个测试条件都可能具有破坏性,因此在这些条件下对设备性能进行建模非常具有成本效益。本文指出需要进行良好的基于​​物理的仿真来进行可靠性研究。对IRGBC40(S,F,U)和IXGH40N60A的坚固性进行的解释比较,可从根本上了解两个设备的物理特性。

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