CERAMIC MULTILAYER TECHNOLOGY　AND LATEST TREND

摘要

Package has been realized as a functional part to draw out function of IC device ,not a package just to encapsulate IC device. In accordance with extraordinary functional innovation and modulation of IC device.rnType of package can be classified roughly into two kinds depending on basic material used, which are ceramic and plastic packages. Ceramic package has advantages on hermeticity, reliability and capability of multilayer as well as fine via hole, compared with plastic package.