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Increasing component functionality via multi-process additive manufacturing

机译:通过多工序增材制造增加组件功能

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Additively manufactured components, although extensively customizable, are often limited in functionality. Multi-process additive manufacturing (AM) grants the ability to increase the functionality of components via subtractive manufacturing, wire embedding, foil embedding and pick and place. These processes are scalable to include several platforms ranging from desktop to large area printers. The Multi~(3D) System is highlighted, possessing the capability to perform the above mentioned processes, all while transferring a fabricated component with a robotic arm. Work was conducted to fabricate a patent inspired, printed missile seeker. The seeker demonstrated the advantage of multi-process AM via introduction of the pick and place process. Wire embedding was also explored, with the successful interconnect of two layers of embedded wires in different planes. A final demonstration of a printed contour bracket, served to show the reduction of surface roughness on a printed part is 87.5% when subtractive manufacturing is implemented in tandem with AM. Functionality of the components on all the cases was improved. Results included optical components embedded within the printed housing, wires embedded with interconnection, and reduced surface roughness. These results highlight the improved functionality of components through multi-process AM, specifically through work conducted with the Multi3D System.
机译:增材制造的组件尽管可广泛定制,但通常在功能上受到限制。多工序增材制造(AM)允许通过减法制造,导线嵌入,箔嵌入和拾取和放置来增加组件的功能。这些过程可扩展以包括从台式机到大面积打印机的多种平台。强调了Multi(3D)系统,该系统具有执行上述过程的能力,而所有这些过程都需要使用机械臂来传送制造的组件。进行了工作,以制造受专利启发的,印刷导弹导引头。搜寻者通过引入拾取和放置过程展示了多过程AM的优势。还研究了导线嵌入,并成功地将两层嵌入式导线在不同平面上互连。印刷轮廓支架的最终演示用于显示与AM一起进行减法制造时,印刷部件表面粗糙度的降低为87.5%。在所有情况下,组件的功能都得到了改善。结果包括将光学组件嵌入印刷外壳内,将电线嵌入互连结构并降低表面粗糙度。这些结果强调了通过多进程AM(特别是通过Multi3D系统执行的工作)改进的组件功能。

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