National Laboratory of Analog ICs;
Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060;
National Laboratory of Analog ICs;
Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060;
National Laboratory of Analog ICs;
Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060;
National Laboratory of Analog ICs;
Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060;
National Laboratory of Analog ICs;
Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060;
Dual-beam structure:Resonant Si:Si/Si bonding:Thinning and polishing:3-D bulk processing; Resonant pressure sensor;
机译:具有温度补偿的电热激发双光束硅谐振压力传感器
机译:具有温度补偿的电热激发双光束硅谐振压力传感器
机译:热激发共振硅微结构压力传感器的温度分布
机译:热激发Si谐振压力传感器温度漂移补偿技术
机译:使用谐振模式传感器的高温压力感测。
机译:基于差分输出的温度补偿方法和温度传感器的谐振压力微阻
机译:热激发共振硅微结构压力传感器的温度分布
机译:适用于石英体声波化学传感器的谐振传感器的自洽温度补偿