Problems and Solutions of Automation of Magnetron Sputtering Process in Vacuum

摘要

The problems of operation of the magnetron sputtering module in vacuum are considered. Elimination of these disadvantages was done by development of new shutter design, which will help to protect wafer from particles from the target. A variant of automation with the aim of improving the quality of the coatings is introduced. In addition to the presence of defects on the target, interfering with the film growth process, failures can occur in the magnetron sputtering module itself. Plasma failures are of several types: pollution in the form of dust particles, metal shavings cause dielectric inclusions, which block the power to the target. Spraying becomes not high-volt, but variable. Chosen motor was implemented to the control system of the described magnetron sputtering module of the machine. Base experimental researches were performed to check quality and efficiency of to be performed modification of design and methods of magnetron sputtering system. Basic experimental studies have confirmed the assumption of obtaining a thin film of copper with good adhesion. The main purpose of the research is to investigate current behavior while film growth. Ampermeter allowed to write to its memory series of measurements. Stored measurement results could be transferred by RS interface to the PC. Using special software ExceLINX this measurement results could be checked. Separate PC is used for this. It is still necessary to evaluate the composition of the obtained thin-film coatings to verify the reduction of impurity oxides in the coating.