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Impact of Oxide Engineering on Analog/RF Performance of Doping-Less DMDG MOSFET

机译:氧化物工程对较少DMDG MOSFET模拟/射频性能的影响

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In order to reduce short channel effects, a dual metal concept has been employed in MOSFETs. But to eliminate the problem of a gate tunneling dual material double gate (DMDG) MOSFET is not sufficient. Hence, to overcome gate tunneling oxide engineering technique has been employed in a DMDG MOSFET. In this paper, a doping-less dual material double gate (DL-DMDG) MOSFET has been analyzed using oxide engineering technique. To induce an n-type substrate in a doping-less MOSFET, charge plasma concept has been incorporated. Using 2D ATLAS simulator various analog/RF parameters have been investigated for this device with different oxide materials. The basic purpose of this paper is to improve analog/RF performance of the device and to increase immunity to SCEs.
机译:为了减少短频道效果,MOSFET采用双金属概念。但是为了消除栅极隧道双材料双栅极(DMDG)MOSFET的问题不够。因此,为了克服栅极隧道氧化物工程技术已经采用了DMDG MOSFET。在本文中,使用氧化物工程技术分析了一种掺杂的双材料双栅极(DL-DMDG)MOSFET。为了在较少的掺杂MOSFET中诱导N型衬底,已经结合了电荷等离子体概念。使用2D ATLAS模拟器,已经为具有不同氧化物材料的该装置研究了各种模拟/ RF参数。本文的基本目的是提高设备的模拟/射频性能,并增加对SCES的免疫力。

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