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A novel capacitor-less DRAM cell using Thin Capacitively-Coupled Thyristor (TCCT)

机译:使用薄电容耦合晶闸管(TCCT)的新型电容器较少的DRAM单元

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A novel capacitor-less DRAM cell using a thin capacitively-coupled thyristor (TCCT DRAM) is introduced. Experimental results from unit memory cell fabricated in a 130nm SOI logic technology demonstrate Ion/Ioff ratio of 10{sup}7, non-destructive Read, Write speed less than 2ns at 125C, and solid retention characteristics. These cell characteristics combined with a small cell area (as low as 9F{sup}2) and simple process integration make TCCT DRAM a suitable candidate for high-performance high-density embedded or standalone memory applications.
机译:引入了使用薄电容耦合晶闸管(TCCT DRAM)的新型电容器的DRAM单元。 130nm SOI逻辑技术中制造的单位存储器单元的实验结果示出了10 {SUP} 7的离子/ IOFF比率,在125℃下的非破坏性读取,写入速度小于2ns,以及固体保持特性。这些单元特性与小的小区区域(低至9F {SUP} 2)和简单的过程集成使TCCT DRAM成为高性能高密度嵌入或独立存储器应用的合适候选者。

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