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Gate Stacked FD-SOI MOS Structure for Better Controllability at High Frequencies

机译:栅极堆叠FD-SOI MOS结构,用于高频率的更好可控性

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This paper presents the analysis on Analog and RF performance of Gate Stack and BOX Stack (GSBS) and Gate Stack (GS) Fully Depleted Silicon On Insulator (FD-SOI) MOSFET. Here stacking of Si3N4 (high-k) over SiO2 layer is used to reduce the short channel effects (SCEs) as well as leakage currents and increase the controllability of the gate electrode on the channel. In the analysis of the analog and RF performance of the proposed structures, it is observed that transconductance (gm), cut off frequency (fT), transconductance frequency product (TFP) is improved by using gate stack while with the use of both gate and Box stacking its RF performance degraded. For high frequency application, stacking anywhere other than gate insulator will lead to degraded performance of the device. The structure is designed and analyse using ATLAS 2D TCAD tools.
机译:本文介绍了栅极堆叠的模拟和RF性能分析,箱堆叠(GSB)和栅极堆叠(GS)完全耗尽硅在绝缘体上(FD-SOI)MOSFET。在这里堆叠si 3 N 4 (高k)在sio 2 层用于减小短频道效应(SCES)以及漏电流并提高通道上栅电极的可控性。在分析所提出的结构的模拟和RF性能中,观察到跨导(GM),切断频率(FT),跨导频率产品(TFP)通过使用两门和使用两种栅极而改善框堆叠其RF性能劣化。对于高频应用,堆叠除了栅极绝缘体之外的任何位置将导致设备的性能下降。使用ATLAS 2D TCAD工具设计和分析结构。

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