首页> 外文会议>IEEE Asia-Pacific Conference on Antennas and Propagation >A Double-layer Embedded Electromagnetic Bandgap Structure with Two Vias for SSN Suppression
【24h】

A Double-layer Embedded Electromagnetic Bandgap Structure with Two Vias for SSN Suppression

机译:具有两个VIA的双层嵌入式电磁带隙结构,用于SSN抑制

获取原文

摘要

A double-layer embedded electromagnetic bandgap (EBG) structure with two vias is presented to suppress the simultaneous switching noise (SSN) in high-speed digital systems. In this paper, the double-layer L-bridge rings with the opposite direction is embedded to the inside of the traditional L-EBG and two vias are distributed around the center of each unit. The proposed EBG structure is simulated by HFSS software. The results show that it can achieve an ultrawide bandgap starting from 1GHz and extending to 16.5 GHz at a suppression level of -50dB and the relative stopband bandwidth is 177%. In addition, the electric field distribution diagram is given to verify the performance of the EBG structure inside and outside the stopband. The results of the electric field distribution strongly support the simulation results of the insertion loss, and demonstrate the ability of the proposed EBG structure to suppress the noise.
机译:提出了一种具有两个通孔的双层嵌入式电磁带隙(EBG)结构以抑制高速数字系统中的同时开关噪声(SSN)。在本文中,具有相反方向的双层L桥环嵌入到传统的L-EBG的内部,并且两个通孔围绕每个单元的中心分布。提出的EBG结构由HFSS软件模拟。结果表明,它可以实现从1GHz开始的超宽度带隙,并在-50dB的抑制水平下延伸到16.5GHz,相对阻带带宽为177%。另外,给出电场分布图以验证停车内外的EBG结构的性能。电场分布的结果强烈支持插入损耗的仿真结果,并证明所提出的EBG结构抑制噪声的能力。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号