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Wafer-Scale Fabrication of Solid-State on-Chip Microsupercapacitors Based on Silicon-Processing Techniques

机译:基于硅处理技术的固态片上微型电路仪的晶片规模制造

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Conventional silicon-based fabrication techniques, ranging from photolithography to various etching processes, are well-established approaches for achieving high-resolution patterns for microelectronics in the semiconductor industry. Although the use of micro fabrication methods in the production of electrochemical energy storage (EES) devices has not really been considered, the adaption of these silicon processing techniques can open up new fabrication routes especially for integrated on-chip energy storage devices. One important consideration for the development of on-chip EES devices is to fabricate a mechanically rigid solid electrolyte with spatial and thickness control, which can be achieved using photopatterning functionality.
机译:传统的基于硅基制造技术,从光刻到各种蚀刻工艺,是实现半导体工业中微电子的高分辨率模式的良好建立的方法。 尽管在电化学能量存储(EES)器件的生产中使用微制造方法并未真正考虑,但是这些硅处理技术的适应可以打开新的制造路线,尤其是集成的片上能量存储装置。 用于开发片上EES器件的一个重要考虑因素是制造具有空间和厚度控制的机械刚性的固体电解质,可以使用光视图型功能来实现。

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