(Invited) How Far Can We Push Conventional Silicon Technology and What are the Future Alternatives?

摘要

Si CMOS technology has dominated the microelectronics industry, with continued scaling. However, future scaling is reaching practical and fundamental limits. Currently, strained-Si channel with high-k/metal gate is the dominant technology. Si FinFETs have provided further innovation to improve electrostatic control of the channel and thus reduce leakage. However, performance enhancement of Si CMOS is beginning to saturate with scaling to nanoscale. To go beyond these limits novel materials and structures are being aggressively studied. Higher mobility semiconductors, like Ge, GeSn and III-Vs, together with innovative device structures could increase drive current and reduce power consumption and delay. Carbon nanotubes and graphene offer very high mobility, excellent electrostatic control of the channel but have problems in manufacturability. Graphene also has the problem of ï½0 bandgap making it not very useful for logic. Recently 2D materials like metal sulfides, telurides and selenides have emerged as potential candidates for nanoscale devices.