首页> 外国专利> Method of making spin-injection devices on silicon material for conventional BiCMOS technology

Method of making spin-injection devices on silicon material for conventional BiCMOS technology

机译:用于常规BiCMOS技术的在硅材料上制造自旋注入器件的方法

摘要

Spin-based microelectronic devices can be realized by utilizing ferromagnetic structures that make good ohmic contact with silicon, in order to avoid the Schottky barrier problem plaguing existing approaches to spin-based microelectronics, while allowing the devices to be based on silicon substrates, which are well-known and used in the industry. Thin layers of metal silicide, such as CoSi2 and NiSi2, are used as an intermediate layer between ferromagnetic contacts, such as cobalt and nickel contacts, and the silicon substrate. The thin silicide layers provide good ohmic contact between the ferromagnetic contacts and silicon, such that spin-polarized carriers can be injected into the silicon, and detected out of the silicon, without loss of spin polarization.
机译:可以通过利用与硅形成良好欧姆接触的铁磁结构来实现基于自旋的微电子器件,以避免肖特基势垒问题困扰现有的基于自旋的微电子方法,同时允许该器件基于硅衬底。在业界知名并使用。金属硅化物的薄层(例如CoSi 2 和NiSi 2 )用作铁磁触点(例如钴和镍触点)与硅基板之间的中间层。薄的硅化物层在铁磁触点和硅之间提供了良好的欧姆接触,因此可以将自旋极化的载流子注入硅中并从硅中检出,而不会损失自旋极化。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号