INCREASING 3D SYSTEM LEVEL INTEGRATION EFFICIENCY AND MECHANICAL ROBUSTNESS BY EMBEDDING WLCSPS WITHIN PRINTED WIRING BOARD ASSEMBLIES

摘要

The drive for ongoing form factor reduction and increased functional integration in handheld portable products continues to drive semiconductor package development. Embedded integrated circuits are emerging as a viable 3D packaging strategy for use both within System in Package modules and in Printed Wiring Board assemblies. This paper outlines a modified WLCSP package format referred to as Embedded Integrated Discretes (EMBIDS) and Embeddable Die Customization (EDC) which NXP and FCI have developed to support high volume embedding applications. Component and board level reliability testing which was carried out as part of this effort confirms the robustness of embedded die PWBs in 3D packaging schemes.