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Influence of special cleaning compounds on PCBs solderability

机译:特殊清洁化合物对PCBS可焊性的影响

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Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). The target of solderability testing was an assessment of cleaning substance influence on solderability. Several types of cleaning substances were used for PCB cleaning. Isopropylalcohol and special cleaning liquids were applied on PCBs before solderability testing. These cleaning liquids shall clean up the surface of PCB from impurities. Most often used lead-free surface finishes were tested (coupons of printed circuit boards with surface finishes galvanic tin, immersion tin, ENIG (electro less nickel immersion gold), OSP (organic solderability preservative) and pure copper).
机译:纸质涉及印刷电路板(PCB)可焊性测试的结果。 可焊性测试的目标是对清洁物质对可焊性的影响进行评估。 用于PCB清洁的几种清洁物质。 在可焊性测试之前,在PCB上施加异丙醇和特殊清洁液。 这些清洁液应清理杂质的PCB表面。 测试最多使用的无铅表面饰面(具有表面的印刷电路板的优惠券,饰面电流锡,浸渍锡,ENIG(电少镍浸渍金),OSP(有机可焊性防腐剂)和纯铜)。

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