Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs

Sitek Janusz; Arazna Aneta; Janeczek Kamil; Steplewski Wojciech; Lipiec Krzysztof; Futera Konrad; Ciszewski Piotr

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Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs

机译：热循环对在长芯和金属芯PCB上执行的焊点可靠性的影响

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摘要

Purpose - The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated thermal cycling.

机译：目的-本文的目的是评估使用加速热循环在长FR-4和金属芯印刷电路板上制作的焊点的可靠性。

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来源
《Soldering & Surface Mount Technology》 |2015年第3期|共5页
作者
Sitek Janusz; Arazna Aneta; Janeczek Kamil; Steplewski Wojciech; Lipiec Krzysztof; Futera Konrad; Ciszewski Piotr;
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正文语种 eng
中图分类焊接一般性问题;
关键词
Solder joints; Reliability; Quality control; Long PCB; MCPCB; Thermal cycling;

机译：焊点;可靠性;质量控制;长PCB;MCPCB;热循环;

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专利

1. Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs [J] . Sitek Janusz, Arazna Aneta, Janeczek Kamil, Soldering & Surface Mount Technology . 2015,第3期

机译：热循环对在长芯和金属芯PCB上执行的焊点可靠性的影响
2. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling [J] . Yanghua Xia, Xiaoming Xie Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2008,第1a2期

机译：热循环下具有不同PCB表面光洁度的无铅焊点的可靠性
3. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling [J] . Yanghua Xia, Xiaoming Xie Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2008,第1a2期

机译：热循环下具有不同PCB表面光洁度的无铅焊点的可靠性
4. Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling [C] . Unique Rahangdale, Rahul Srinivas, S. Krishnamurthy, Annual Semiconductor Thermal Measurement and Management Symposium . 2017

机译：功率循环和热循环下PCB厚度对四方扁平无铅组件焊点可靠性的影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints [O] . Saeed Akbari, Andreas Lövberg, Per-Erik Tegehall, 2019

机译：PCB裂缝对单粒焊点无源微电子成分热循环可靠性的影响
8. Formation of Intermetallic Compounds in Solder Joints and Its Effects on Joint Reliability. [R] . Zeng, K., Peng, W., Kivilahti, J. 2001

机译：焊点中金属间化合物的形成及其对接头可靠性的影响。

Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs

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