Reliability and high frequency behaviour of flip chip assemblies with low cost encapsulation

摘要

The protection of GaAs high frequency components against mechanical and environmental influences is necessary to guarantee performance and life time. Conventional RF-packaging however is a very cost intensive factor and therefore it is necessary to search for more economical packaging methods. Flip chip mounting with epoxy underfilling seems to be an interesting solution for cost effective RF-packaging. This paper describes the reliability and the high frequency behaviour of GaAs flip chip assemblies with epoxy encapsulation in the range from 45 MHz up to 75 GHz.