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On the mechanisms of target modification by ion beams and laser pulses

机译:关于离子束和激光脉冲的目标改性机制

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A comparison is made between the importance of the following categories of processes in ion-surface and laser-surface interactions: ballistic, thermal-spike, residual-defect-induced, and electronic. It is shown that ballistic processes are important for ion sputtering, ion mixing, and ion composition change. Also, they exist with laser-pulse sputtering but are not important. The picture with thermal-spike processes is the inverse, such processes being unimportant in most ion-surface interactions, but very important indeed with laser-pulse sputtering. In the latter case one must distinguish between normal vaporization and phase explosion, both of which are fundamental. On the other hand, normal boiling may possibly be unimportant owing to the negligible density of heterogeneous nuclei formed in the bulk, approx 10~6 kg~-1. However, it is essential to note that, if nuclei can be formed at the surface, the density will be much higher. Sputtering due to subsurface heating probably does not exist. Residual defects are basic to all ion-surface interactions, but most especially to ion mixing. Here most (approx 90
机译:在离子表面和激光表面相互作用中以下类别的过程的重要性之间进行比较:弹道,热穗,残余缺陷诱导和电子。结果表明,弹道过程对于离子溅射,离子混合和离子组成变化很重要。而且,它们存在激光脉冲溅射,但并不重要。具有热尖峰工艺的图像是逆的,在大多数离子表面相互作用中具有不重要的过程,但实际上具有激光脉冲溅射非常重要。在后一种情况下,必须区分正常汽化和相爆炸,这两者都是基本的。另一方面,由于散装中形成的多均匀核的密度可忽略不计,大约10〜6 kg〜-1,正常沸腾可能是不重要的。然而,必须注意,如果可以在表面形成细胞核,则密度将要高得多。由于地下加热而溅射可能不存在。残余缺陷对所有离子表面相互作用基本,但最尤其是离子混合。在这里(大约90

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